Semiconductor device including capacitor under pad
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United States of America Patent
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Mar 31, 2015
Grant Date -
Jun 28, 2012
app pub date -
Sep 18, 2011
filing date -
Dec 27, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, a semiconductor device includes a semiconductor chip which includes a semiconductor integrated circuit provided in an insulator, a first pad a pad having an upper surface of which is exposed via an opening formed in the insulator, and capacitors provided in a capacitor region of the semiconductor chip under the pad. The capacitors are provided in the capacitor region to satisfy a rule of a coverage. And contacts respectively connected to two electrodes of the capacitors are provided at positions that do not vertically overlap the opening.
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