Circuit system in a package
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United States of America Patent
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-
Mar 31, 2015
Grant Date -
N/A
app pub date -
May 27, 2011
filing date -
May 27, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame and encapsulated, thus providing an environmentally sealed package which is manufactured using standard circuit fabrication methods and machinery.
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Family
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Cited Art Landscape
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