Chip resistor and method of manufacturing the same

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United States of America Patent

PATENT NO 8994491
SERIAL NO

13716982

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Abstract

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There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).

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Patent Owner(s)

  • SAMSUNG ELECTRO-MECHANICS CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Heun Ku Suwon-si, KR 1 11
Kim, Jung Il Suwon-si, KR 20 19
Kim, Yong Min Suwon-si, KR 70 262
Kim, Young Tae Suwon-si, KR 113 543
Tanaka, Ichiro Suwon-si, KR 101 707

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