Integrated circuit package with molded cavity

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United States of America Patent

PATENT NO 8999754
SERIAL NO

13463148

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Abstract

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An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Seng Guan Singapore, SG 216 7143
Han, Byung Joon Singapore, SG 75 2483
Shim, Il Kwon Singapore, SG 235 6832

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