Integrated circuit package system with bonding in via

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9000579
APP PUB NO 20080237873A1
SERIAL NO

11694912

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Importance

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Abstract

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An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abinan, Rachel Layda Singapore, SG 7 161
Espiritu, Emmanuel Singapore, SG 44 241
Filoteo,, Jr Dario S Singapore, SG 22 150
Shim, Il Kwon Singapore, SG 235 6843

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