Bending die having surface microstructures and bending punch thereof
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United States of America Patent
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Apr 14, 2015
Grant Date -
Apr 2, 2015
app pub date -
Feb 26, 2014
filing date -
Sep 30, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a bending die having surface microstructures and a bending punch thereof applicable to stamping processing to bend a blank to form a shape. The bending die includes a lower die, an upper die, and a workpiece placing piece. The lower die includes a die, and the die includes a forming surface. The upper die includes a bending punch, the bending punch stamps a blank placed on the die in a back and forth stroke, and the bending punch includes a working portion coming into contact with the blank during stamping. The workpiece placing piece is disposed between the upper die and the lower die and used to position or/and press the blank placed on the die. A plurality of microstructures are disposed on the forming surface and/or on the surface of the working portion.
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