Connector with gold-palladium plated contacts
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United States of America Patent
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Apr 14, 2015
Grant Date -
Feb 13, 2014
app pub date -
Feb 21, 2013
filing date -
Aug 10, 2012
priority date (Note) -
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Abstract
An improved outer layer of plating comprising a binary metal alloy of gold and palladium is employed on connector contacts. The binary metal alloy is plated on at least the contact surface of the contacts. Intermediate plating layers can be applied between the outer layer of gold and palladium and the conductive base of the contacts. The binary metal alloy of gold and palladium may be configured to have a mostly gold or a mostly silver appearance, depending upon the relative concentration of gold and palladium in the binary metal alloy.
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