Apparatuses and methods for seaming substrates
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United States of America Patent
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Apr 14, 2015
Grant Date -
Aug 22, 2013
app pub date -
Feb 22, 2012
filing date -
Feb 22, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.
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