Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
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United States of America Patent
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Apr 14, 2015
Grant Date -
Dec 27, 2012
app pub date -
Jun 23, 2011
filing date -
Jun 23, 2011
priority date (Note) -
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Abstract
A semiconductor device has a carrier with a die attach area. Recesses are formed partially through the carrier outside the die attach area. A first conductive layer is conformally applied over a surface of the carrier and into the recesses. A semiconductor die is mounted to the die attach area of the carrier. An encapsulant is deposited over the carrier and semiconductor die. The encapsulant extends into the recesses over the first conductive layer to form encapsulant bumps. The carrier is removed to expose the first conductive layer over the encapsulant bumps. A first insulating layer is formed over the semiconductor die with openings to expose contact pads of the semiconductor die. A second conductive layer is formed between the first conductive layer and the contact pads on the semiconductor die. A second insulating layer is formed over the second conductive layer and semiconductor die.
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