Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
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United States of America Patent
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Apr 14, 2015
Grant Date -
Oct 11, 2012
app pub date -
Jun 15, 2012
filing date -
Apr 14, 2008
priority date (Note) -
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Abstract
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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