Method for manufacturing conductors and semiconductors
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United States of America Patent
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Apr 21, 2015
Grant Date -
Dec 10, 2009
app pub date -
Jul 5, 2007
filing date -
Jul 21, 2006
priority date (Note) -
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Abstract
The invention relates to a sintering method for manufacturing structures by sintering. In addition, the invention relates to a sintered product, an electronic module, and new uses. In the method, a particle material containing conductive or semiconductive encapsulated nanoparticles is sintered, in order to increase its electrical conductivity, by applying a voltage over the particle material. In the method, a substrate is typically used, one surface of which is at least partly equipped with a layer containing nanoparticles. The method is based on thermal feedback between the voltage feed and the nanoparticles. The invention permits the manufacture of conductive and semiconductive structures and pieces by sintering at room temperature and at normal pressure.
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