Method of bonding panels of dissimilar material and bonded structure
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United States of America Patent
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Apr 21, 2015
Issued Date -
N/A
app pub date -
May 17, 2012
filing date -
May 17, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A method of bonding a first panel made of a first material to a second panel made of a second material is provided. The method includes creating a second panel hole in the second panel at a weld location. An insert composed of the first material is inserted into the second panel hole in the second panel. At least a portion of the insert is fittable in the second panel hole and sized to correspond to the second panel hole. The first panel and the insert are welded together at the weld location, thereby bonding the first and second panels. In one embodiment, the first and second panels are placed between the first and second electrodes of a welding gun. A force is applied to clamp the insert and the first panel between the first and second electrodes and a welding current is delivered. A bonded structure is provided.
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