Electronic system for reflow soldering
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United States of America Patent
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Apr 21, 2015
Grant Date -
Apr 4, 2013
app pub date -
Sep 25, 2012
filing date -
Sep 30, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.
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