Copper alloy composite and method for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9017569
APP PUB NO 20140202983A1
SERIAL NO

14223337

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for preparing a copper alloy given a certain special surface shape yields tremendous bonding strength through compatibility with an epoxy resin adhesive. With a composite part in which this technology is utilized to integrate a copper alloy member as a cover material with a CFRP, it is possible to take advantage of the characteristics of both the copper alloy and the FRP due to the tremendous bonding strength. In a step in which an FRP prepreg is put into a mold and heated and cured, usually the mold is first coated with a release agent to facilitate release from the mold, but with high-technology CFRP, bleeding of the release agent often diminishes the properties. A copper alloy sheet 21 is used as a cover material, and a CFRP 22 is cured.

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Patent Owner(s)

Patent OwnerAddress
TAISEI PLAS CO LTD11-8 NIHONBASHI-HAMACHO 1-CHOME CHUO-KU TOKYO 103-0007

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andoh, Naoki Tokyo, JP 41 234
Naritomi, Masanori Tokyo, JP 50 682

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