EBG structure, semiconductor device, and printed circuit board
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United States of America Patent
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Apr 28, 2015
Grant Date -
Oct 3, 2013
app pub date -
Nov 15, 2012
filing date -
Mar 29, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An EBG structure according to an embodiment includes an electrode unit made of a first conductor and provided with a space, a patch unit provided approximately parallel to the electrode unit and made of a second conductor, an insulating layer provided between the electrode unit and the patch unit, a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit, and a second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit.
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