Liquid ejecting head and liquid ejecting apparatus
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United States of America Patent
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-
May 5, 2015
Grant Date -
Oct 2, 2014
app pub date -
Mar 24, 2014
filing date -
Mar 27, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.
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