Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
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United States of America Patent
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May 5, 2015
Grant Date -
Jan 15, 2015
app pub date -
Jul 15, 2013
filing date -
Jul 15, 2013
priority date (Note) -
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Abstract
A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. An encapsulation separates respective pairs of coupled first and second connectors from one another and may encapsulate the microelectronic element and fill spaces between the support elements. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns.
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