Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body

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United States of America Patent

PATENT NO 9023913
APP PUB NO 20140364531A1
SERIAL NO

14365930

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g., solvent and curable monomer), and has small in-plane retardation, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATION23-23 HONCHO ITABASHI-KU TOKYO 1730001 ?1730001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimoto, Hironobu Tokyo, JP 11 69
Ito, Masaharu Tokyo, JP 100 760
Iwaya, Wataru Tokyo, JP 18 72
Taya, Naoki Tokyo, JP 46 111

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