Conductor with sub-lithographic self-aligned 3D confinement
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United States of America Patent
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May 5, 2015
Grant Date -
Feb 12, 2015
app pub date -
Aug 12, 2013
filing date -
Aug 12, 2013
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Abstract
A three-dimensionally (3d) confined conductor advantageously used as an electronic fuse and self-aligned methods of forming the same. By non-conformal deposition of a dielectric film over raised structures, a 3d confined tube, which may be sub-lithographic, is formed between the raised structures. Etching holes which intersect the 3d confined region and subsequent metal deposition fills the 3d confined region and forms contacts. When the raised structures are gates, the fuse element may be located at the middle of the line (i.e. in pre-metal dielectric). Other methods for creating the structure are also described.
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