Motion analysis device and motion analysis method for analyzing deformation of measurement object
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United States of America Patent
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May 5, 2015
Grant Date -
Jul 12, 2012
app pub date -
Jan 10, 2012
filing date -
Jan 11, 2011
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Abstract
A motion analysis device includes two posture angle sensors attached to a measurement object at locations distant from each other, a data acquisition section, a posture angle correction section, and a deformation amount calculation section. The data acquisition section acquires data of a first posture angle and a second posture angle respectively detected by the posture angle sensors. The posture angle correction section corrects a difference between the first posture angle and the second posture angle after starting a motion of the measurement object in accordance with a difference between the first posture angle and the second posture angle before starting the motion of the measurement object. The deformation amount calculation section calculates a deformation amount of the measurement object based on a difference between the first posture angle and the second posture angle corrected by the posture angle correction section.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- SEIKO EPSON CORPORATION
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Nomura, Kazuo | Shiojiri, JP | 63 | 1536 |
Sato, Masatoshi | Hashima, JP | 155 | 2490 |
Takasugi, Toshiyasu | Hadano, JP | 5 | 126 |
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