Multilayer adhesive sheet and method for manufacturing electronic component

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United States of America Patent

PATENT NO 9028638
APP PUB NO 20130092318A1
SERIAL NO

13805749

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.

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Patent Owner(s)

  • DENKI KAGAKU KOGYO KABUSHIKI KAISHA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Saito, Takeshi Shibukawa, JP 395 6705
Shikano, Kazunori Shibukawa, JP 9 66

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