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United States of America Patent

PATENT NO 9028657
APP PUB NO 20120061246A1
SERIAL NO

12879484

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Abstract

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Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

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Patent Owner(s)

  • NOVELLUS SYSTEMS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Jingbin Lake Oswego, US 33 764
Ghongadi, Shantinath Wilsonville, US 47 505
He, Zhian Tigard, US 41 818
Stowell, R Marshall Wilsonville, US 18 631
Wilmot, Frederick Dean Gladstone, US 12 95

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