Integrated circuit packaging system having planar interconnect and method for manufacture thereof
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United States of America Patent
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May 12, 2015
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N/A
app pub date -
Mar 7, 2011
filing date -
Sep 25, 2008
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Abstract
A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.
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