Semiconductor devices having three-dimensional bodies with modulated heights
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United States of America Patent
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May 12, 2015
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Dec 5, 2013
app pub date -
Dec 21, 2011
filing date -
Dec 21, 2011
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Abstract
Semiconductor devices having three-dimensional bodies with modulated heights and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a first semiconductor body disposed above a substrate. The first semiconductor body has a first height and an uppermost surface with a first horizontal plane. The semiconductor structure also includes a second semiconductor device having a second semiconductor body disposed above the substrate. The second semiconductor body has a second height and an uppermost surface with a second horizontal plane. The first and second horizontal planes are co-planar and the first and second heights are different.
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