Integrated circuit package system with internal stacking module
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United States of America Patent
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May 12, 2015
Grant Date -
Nov 22, 2012
app pub date -
Jul 31, 2012
filing date -
Jun 9, 2008
priority date (Note) -
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Abstract
An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module.
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