Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same
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United States of America Patent
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May 19, 2015
Grant Date -
Aug 29, 2013
app pub date -
Feb 19, 2013
filing date -
Feb 23, 2012
priority date (Note) -
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Abstract
Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
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