Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
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United States of America Patent
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May 19, 2015
Grant Date -
Jan 15, 2015
app pub date -
Jul 15, 2013
filing date -
Jul 15, 2013
priority date (Note) -
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Abstract
A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. Dielectric reinforcing collars are provided on outer surfaces of the first connectors, second connectors or both, and an encapsulation separates pairs of coupled connectors from one another and may fill spaces between support elements.
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