Integrated, integrated circuit singulation system

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United States of America Patent

PATENT NO 9034731
SERIAL NO

11162622

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Abstract

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An integrated, integrated circuit singulation system is provided including scribing a substrate using mechanical cutting or a plurality of passes of laser cutting, and dicing the substrate using mechanical cutting or laser cutting.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Seung Wook Seoul, KR 548 7288

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