Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same

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United States of America Patent

PATENT NO 9034750
APP PUB NO 20140117070A1
SERIAL NO

13846057

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Abstract

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A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Ho-eun Gyeongsangnam-do, KR 1 2
Bae, Hyun-cheol Daejeon, KR 27 118
Choi, Kwang-Seong Daejeon, KR 51 327
Eom, Yong Sung Daejeon, KR 48 160
Jeon, Su Jeong Jeollabuk-do, KR 1 2

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