Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member

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United States of America Patent

PATENT NO 9035449
APP PUB NO 20120012356A1
SERIAL NO

13203037

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Abstract

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[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

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Patent Owner(s)

  • DAISHINKU CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kohda, Naoki Kakogawa, JP 15 96
Satoh, Syunsuke Kakogawa, JP 12 93
Yoshioka, Hiroki Kakogawa, JP 81 434

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