Forming semiconductor chip connections

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United States of America Patent

PATENT NO 9035465
SERIAL NO

14273975

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Abstract

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Various embodiments include semiconductor structures. In one embodiment, the semiconductor structure includes a chip having a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Kangguo Schenectady, US 3073 29638
Dalton, Timothy J Ridgefield, US 142 2884
Farooq, Mukta G Hopewell Junction, US 212 3359
Fitzsimmons, John A Poughkeepsie, US 114 1316
Hsu, Louis L Fishkill, US 299 8481

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