Three dimensional branchline coupler using through silicon vias and design structures

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United States of America Patent

PATENT NO 9035719
APP PUB NO 20150054595A1
SERIAL NO

13974659

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Abstract

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A three dimensional (3D) branchline coupler using through silicon vias (TSV), methods of manufacturing the same and design structures are disclosed. The method includes forming a first waveguide structure in a first dielectric material. The method further includes forming a second waveguide structure in a second dielectric material. The method further includes forming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION;UNIVERSITY OF SOUTH CAROLINA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dewitt, Barbara S Essex Junction, US 7 24
Mina, Essam South Burlington, US 23 117
Rahman, BM Farid West Columbia, US 3 9
Wang, Guoan Irmo, US 42 234
Woods,, Jr Wayne H Burlington, US 59 281

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