Multilayer chip capacitor and method of fabricating the same

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United States of America Patent

PATENT NO 9036330
APP PUB NO 20100238605A1
SERIAL NO

12650134

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Abstract

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A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m≧3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.

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Patent Owner(s)

  • SAMSUNG ELECTRO-MECHANICS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Hae Suk Seoul, KR 54 580
Lee, Byoung Hwa Gyunggi-do, KR 173 1885
Park, Dong Seok Seoul, KR 58 923
Park, Min Cheol Gyunggi-do, KR 177 1816
Park, Sang Soo Gyunggi-do, KR 263 2439
Wi, Sung Kwon Seoul, KR 132 984

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