Method of fabricating a polymer waveguide

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United States of America Patent

PATENT NO 9036956
SERIAL NO

13399098

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Abstract

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A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bao, Tien-I Dayuan Township, Taoyuan County, TW 278 5423
Chen, Hai-Ching Hsinchu, TW 224 979
Lee, Wan-Yu Taipei, TW 40 284
Tseng, Chun-Hao Taichung, TW 53 652

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