Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 26, 2015
Grant Date -
Nov 1, 2012
app pub date -
Nov 16, 2010
filing date -
Nov 17, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully