Method for bonding substrates using a UV radiation curing-redox curing adhesive system

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United States of America Patent

PATENT NO 9039852
APP PUB NO 20140138013A1
SERIAL NO

14162880

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Abstract

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The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

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Patent Owner(s)

Patent OwnerAddress
HENKEL US IP LLCONE HENKEL WAY ROCKY HILL CT 06067

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Attarwala, Shabbir Simsbury, US 63 687
Lu, Daoqiang Chandler, US 127 2004
Song, Chongjian Shanghai, CN 5 1
Yuan, Yinxiao Shanghai, CN 3 29
Zhou, Nicolas Shanghai, CN 1 10

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