Multilayered circuit type antenna package
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United States of America Patent
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May 26, 2015
Grant Date -
Apr 25, 2013
app pub date -
Jun 22, 2012
filing date -
Oct 19, 2011
priority date (Note) -
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Abstract
A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
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