Integrated drive-motor assembly with IP seal and enhanced heat transfer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 2, 2015
Grant Date -
May 8, 2014
app pub date -
Nov 5, 2012
filing date -
Nov 5, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the floor and conducts heat into the mounting flange. An environmental seal is located between the lower edge of the frame and the sealing surface of the mounting flange and extending coextensively with the lower edge of the peripheral wall such that a sealing zone is defined within the peripheral wall of the frame and the first and second thermal interfaces are located within the sealing zone.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully