Multi-piece-array and method of manufacturing the same
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United States of America Patent
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Jun 2, 2015
Grant Date -
Jul 18, 2013
app pub date -
Sep 30, 2011
filing date -
Oct 8, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.
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