Thermally polymerizable resin composition

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United States of America Patent

PATENT NO 9051422
APP PUB NO 20100273941A1
SERIAL NO

12310522

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Abstract

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A water-soluble thermally polymerizable oxetane resin composition comprises (A) a water-soluble oxetane compound and (B) at least one heteropolyacid compound selected from heteropolyacids and heteropolyacid salts. The water-soluble oxetane compound may contain one or more oxetane functional groups in the molecule and one or more alcoholic OH groups in the molecule. The heteropolyacids include phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, silicomolybdic acid or mixtures thereof. The heteropolyacid salts include phosphotungstic acid salts, phosphomolybdic acid salts, silicotungstic acid salts, silicomolybdic acid salts or mixtures thereof.

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Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL CHEMICAL & MATERIAL CO LTD13-1 NIHONBASHI 1-CHOME CHUO-KU TOKYO 103-0027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Banno, Keiji Fukuoka, JP 2 0
Katayama, Atsuhiko Fukuoka, JP 6 40
Senzaki, Toshihide Tokyo, JP 7 15
Shrestha, Niranjan Kumar Fukuoka, JP 4 15

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