Positive photosensitive composition and method of forming pattern using the same

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United States of America Patent

PATENT NO 9052594
APP PUB NO 20120058431A1
SERIAL NO

13293290

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Abstract

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A positive photosensitive composition includes: a resin (A) whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin (A) containing an acid decomposable repeating unit represented by a general formula (I) and an acid nondecomposable repeating unit represented by a general formula (II); and a compound (B) capable of generating an acid upon irradiation with one of active rays and radiations:

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kodama, Kunihiko Shizuoka, JP 160 2223
Sugimoto, Naoya Shizuoka, JP 84 384
Takahashi, Hyou Shizuoka, JP 25 150
Yamamoto, Kei Shizuoka, JP 117 603

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