Exposing connectors in packages through selective treatment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9054047
APP PUB NO 20140131896A1
SERIAL NO

14157617

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Abstract

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A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chun-Cheng New Taipei, TW 100 1465
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Yu, Chen-Hua Hsinchu, TW 2207 47923

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