Stacked interconnect heat sink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9054064
APP PUB NO 20130280864A1
SERIAL NO

13921707

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.

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Patent Owner(s)

  • BELL SEMICONDUCTOR, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bachman, Mark A Sinking Spring, US 14 207
Merchant, Sailesh M Macungie, US 56 845
Osenbach, John W Kutztown, US 72 671

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