High performance on-chip vertical coaxial cable, method of manufacture and design structure
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United States of America Patent
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Jun 9, 2015
Grant Date -
Mar 6, 2014
app pub date -
Nov 11, 2013
filing date -
Feb 1, 2011
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Abstract
A high performance on-chip vertical coaxial cable structure, method of manufacturing and design structure thereof is provided. The coaxial cable structure includes an inner conductor and an insulating material that coaxially surrounds the inner conductor. The structure further includes an outer conductor which surrounds the insulating material. Both the inner and outer conductors comprise a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by conductors. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface.
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