Multi-step and asymmetrically shaped laser beam scribing

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United States of America Patent

PATENT NO 9054176
SERIAL NO

14023408

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Abstract

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Methods of dicing substrates by both laser scribing and plasma etching are disclosed. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, lower than the first. Multiple passes of a beam adjusted to have different fluence level or multiple laser beams having various fluence levels may be utilized to ablate mask and IC layers to expose a substrate with the first fluence level and then clean off redeposited materials from the trench bottom with the second fluence level. A laser scribe apparatus employing a beam splitter may provide first and second beams of different fluence from a single laser.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eaton, Brad Menlo Park, US 112 1444
Holden, James M San Jose, US 57 1975
Kumar, Ajay Cupertino, US 489 10751
Lei, Wei-Sheng San Jose, US 131 1180
Singh, Saravjeet Santa Clara, US 75 1910
Yalamanchili, Madhava Rao Morgan Hill, US 56 645

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