Integrated capacitor having a non-uniform thickness

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United States of America Patent

PATENT NO 9054225
APP PUB NO 20100164066A1
SERIAL NO

12649235

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Abstract

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An embodiment of an electronic device integrated in a chip of semiconductor material and an embodiment of a corresponding production method are proposed. The electronic device includes a capacitor having a first conductive plate, a second conductive plate, and an insulating layer for insulating the first plate from the second plate. In an embodiment of the disclosure, at least a selected one between the first plate and the second plate has a non-uniform thickness.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Di, Franco Antonio Osnago, IT 8 31

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