Sidewalls of electroplated copper interconnects
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United States of America Patent
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Jun 9, 2015
Grant Date -
Jan 30, 2014
app pub date -
Oct 1, 2013
filing date -
Jun 18, 2012
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Abstract
A structure including a seed layer located directly on top of and conformal to the diffusion barrier, wherein the seed layer is parallel to the sidewall and bottom of the opening, the seed layer comprises a crystalline structure suitable for plating copper; a first intermetallic compound and an alloy layer parallel to the sidewall of the opening and separating the seed layer from the conductive material, the first intermetallic compound is a precipitate within a solid solution of an alloying material of the alloy layer and the conductive material, and is molecularly bound to both the alloy layer and the conductive material, and a first high friction interface located between the seed layer and the alloy layer extending in a direction parallel to the sidewall of the opening, wherein the first high friction interface results in a mechanical bond between the seed layer and the alloy layer.
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