Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
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United States of America Patent
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Jun 16, 2015
Grant Date -
Jul 26, 2012
app pub date -
Jan 20, 2011
filing date -
Jan 20, 2011
priority date (Note) -
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Abstract
Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.
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