Phase changing on-chip thermal heat sink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 16, 2015
Issued Date -
N/A
app pub date -
Dec 31, 2012
filing date -
Dec 31, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully