Chamfered corner crackstop for an integrated circuit chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 16, 2015
Grant Date -
Apr 25, 2013
app pub date -
Oct 19, 2011
filing date -
Oct 19, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A corner crackstop is formed in each of the four corners of an integrated circuit (IC) chip, in which the corner crackstop differs structurally from a portion of the crackstop disposed along the sides of the IC chip. Each corner crackstop includes a plurality of layers, formed on a top surface of a silicon layer of the IC chip, within a perimeter boundary region that comprises a triangular area, in which a right angle is disposed on a bisector of the corner, equilateral sides of the triangle are parallel to sides of the IC chip, and the right angle is proximate to the corner relative to a hypotenuse of the triangle. The plurality of layers of the corner crackstop include crackstop elements, each comprising a metal cap centered over a via bar, in which the plurality of layers of the corner crackstop is chamfered to deflect crack ingress forces by each corner crackstop.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully